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{ "item_title" : "High Performance Devices - Proceedings of the 2004 IEEE Lester Eastman Conference", "item_author" : [" Robert Leoni "], "item_description" : "This volume presents state-of-the-art works from top academic and research institutions in the areas of high performance semiconductor materials, devices, and circuits. A broad coverage of topics relating to high performance devices and circuits is featured here. There are 46 contributed papers covering a wide range of materials, device types, and applications. These papers describe the results of ongoing research in three general areas: high speed technologies for advanced mixed signal and terahertz applications, advanced technologies for high performance optical links and light sources, and high power density and high efficiency technologies for next generation microwave front ends and power electronics.", "item_img_path" : "https://covers2.booksamillion.com/covers/bam/9/81/256/196/981256196X_b.jpg", "price_data" : { "retail_price" : "211.00", "online_price" : "211.00", "our_price" : "211.00", "club_price" : "211.00", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }
High Performance Devices - Proceedings of the 2004 IEEE Lester Eastman Conference|Robert Leoni

High Performance Devices - Proceedings of the 2004 IEEE Lester Eastman Conference

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Overview

This volume presents state-of-the-art works from top academic and research institutions in the areas of high performance semiconductor materials, devices, and circuits. A broad coverage of topics relating to high performance devices and circuits is featured here. There are 46 contributed papers covering a wide range of materials, device types, and applications. These papers describe the results of ongoing research in three general areas: high speed technologies for advanced mixed signal and terahertz applications, advanced technologies for high performance optical links and light sources, and high power density and high efficiency technologies for next generation microwave front ends and power electronics.

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Details

  • ISBN-13: 9789812561961
  • ISBN-10: 981256196X
  • Publisher: World Scientific Publishing Company
  • Publish Date: April 2005
  • Dimensions: 10.02 x 6.7 x 0.88 inches
  • Shipping Weight: 1.5 pounds
  • Page Count: 316

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