{ "item_title" : "Advanced Interconnects for ULSI Technology", "item_author" : [" Mikhail Baklanov", "Paul S. Ho", "Ehrenfried Zschech "], "item_description" : "Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: *Interconnect functions, characterisations, electrical properties and wiring requirements *Low-k materials: fundamentals, advances and mechanical properties *Conductive layers and barriers *Integration and reliability including mechanical reliability, electromigration and electrical breakdown *New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.", "item_img_path" : "https://covers1.booksamillion.com/covers/bam/0/47/066/254/0470662549_b.jpg", "price_data" : { "retail_price" : "245.95", "online_price" : "245.95", "our_price" : "245.95", "club_price" : "245.95", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

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