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{ "item_title" : "Advanced Polyimide Materials", "item_author" : [" Shi-Yong Yang "], "item_description" : "Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.", "item_img_path" : "https://covers1.booksamillion.com/covers/bam/0/12/812/640/012812640X_b.jpg", "price_data" : { "retail_price" : "200.00", "online_price" : "200.00", "our_price" : "200.00", "club_price" : "200.00", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }
Advanced Polyimide Materials|Shi-Yong Yang

Advanced Polyimide Materials : Synthesis, Characterization, and Applications

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Overview

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research.

The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.

This item is Non-Returnable

Details

  • ISBN-13: 9780128126400
  • ISBN-10: 012812640X
  • Publisher: Elsevier
  • Publish Date: April 2018
  • Dimensions: 10.8 x 8.51 x 1.11 inches
  • Shipping Weight: 3.5 pounds
  • Page Count: 498

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