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Advanced Semiconductor Packaging Handbook : Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test
Overview
This item is Non-Returnable
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Details
- ISBN-13: 9798189958878
- ISBN-10: 9798189958878
- Publisher: Independently Published
- Publish Date: July 2026
- Dimensions: 11 x 8.5 x 1.03 inches
- Shipping Weight: 2.59 pounds
- Page Count: 512
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