{ "item_title" : "Advanced Wirebond Interconnection Technology", "item_author" : [" Shankara K. Prasad "], "item_description" : "Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.", "item_img_path" : "https://covers4.booksamillion.com/covers/bam/1/40/207/762/1402077629_b.jpg", "price_data" : { "retail_price" : "359.00", "online_price" : "359.00", "our_price" : "359.00", "club_price" : "359.00", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

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