{
"item_title" : "Feature Profile Evolution in Plasma Processing Using On-Wafer Monitoring System",
"item_author" : [" Seiji Samukawa "],
"item_description" : "Introduction.- Background.- On-wafer monitoring technique.- On-wafer UV sensor and prediction of UV irradiation damage.- Introduction.- Prediction system for UV spectrum.- Prediction system for UV-radiation damage in dielectric films.- Prediction of Abnormal Etching Profile in High-Aspect-Ratio Via/Hole Etching Using On-Wafer Monitoring System.- Introduction.- Ion-trajectory prediction.- Twisting prediction.- Feature Profile Evolution in Plasma Processing using Wireless On-wafer Monitoring System.- Introduction.- Experimental Results and Discussion.- Conclusions.",
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Feature Profile Evolution in Plasma Processing Using On-Wafer Monitoring System
Overview
Introduction.- Background.- On-wafer monitoring technique.- On-wafer UV sensor and prediction of UV irradiation damage.- Introduction.- Prediction system for UV spectrum.- Prediction system for UV-radiation damage in dielectric films.- Prediction of Abnormal Etching Profile in High-Aspect-Ratio Via/Hole Etching Using On-Wafer Monitoring System.- Introduction.- Ion-trajectory prediction.- Twisting prediction.- Feature Profile Evolution in Plasma Processing using Wireless On-wafer Monitoring System.- Introduction.- Experimental Results and Discussion.- Conclusions.
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Details
- ISBN-13: 9784431547945
- ISBN-10: 4431547940
- Publisher: Springer
- Publish Date: February 2014
- Dimensions: 9.21 x 6.14 x 0.11 inches
- Shipping Weight: 0.19 pounds
- Page Count: 40
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