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{ "item_title" : "Information Science and Electronic Engineering", "item_author" : [" Dongxing Wang "], "item_description" : "The 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016) was held January 4-5, 2016 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The topics covered at ICEEIS2016 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, and information science.", "item_img_path" : "https://covers2.booksamillion.com/covers/bam/1/13/802/987/1138029874_b.jpg", "price_data" : { "retail_price" : "280.00", "online_price" : "280.00", "our_price" : "280.00", "club_price" : "280.00", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }
Information Science and Electronic Engineering|Dongxing Wang

Information Science and Electronic Engineering : Proceedings of the 3rd International Conference of Electronic Engineering and Information Science (ICE

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Overview

The 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016) was held January 4-5, 2016 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The topics covered at ICEEIS2016 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, and information science.

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Details

  • ISBN-13: 9781138029873
  • ISBN-10: 1138029874
  • Publisher: CRC Press
  • Publish Date: December 2016
  • Dimensions: 9.61 x 6.69 x 1.06 inches
  • Shipping Weight: 2.11 pounds
  • Page Count: 462

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