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{ "item_title" : "6th International Conference on Electronics and Signal Processing", "item_author" : [" Seokwon Yeom "], "item_description" : "This book includes selected and presented papers at 2025 6th International Conference on Electronics and Signal Processing (ICESP 2025) that was held in Hong Kong during January 10-12, 2025, which brings together contributions from both academia and industry, focusing on a diverse aspect of signal processing and information communication systems. The papers present the latest technological developments of the related fields. The theoretical and practical solutions in the papers can serve as a useful reference for students, researchers, and engineers in signal processing and system applications. The renowned researchers and investigators contribute their original research or review articles to the book.", "item_img_path" : "https://covers3.booksamillion.com/covers/bam/3/03/194/972/3031949722_b.jpg", "price_data" : { "retail_price" : "249.99", "online_price" : "249.99", "our_price" : "249.99", "club_price" : "249.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }
6th International Conference on Electronics and Signal Processing|Seokwon Yeom

6th International Conference on Electronics and Signal Processing : Icesp 2025

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Overview

This book includes selected and presented papers at 2025 6th International Conference on Electronics and Signal Processing (ICESP 2025) that was held in Hong Kong during January 10-12, 2025, which brings together contributions from both academia and industry, focusing on a diverse aspect of signal processing and information communication systems. The papers present the latest technological developments of the related fields. The theoretical and practical solutions in the papers can serve as a useful reference for students, researchers, and engineers in signal processing and system applications. The renowned researchers and investigators contribute their original research or review articles to the book.

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Details

  • ISBN-13: 9783031949722
  • ISBN-10: 3031949722
  • Publisher: Springer
  • Publish Date: October 2025
  • Dimensions: 9.21 x 6.14 x 0.94 inches
  • Shipping Weight: 1.69 pounds
  • Page Count: 411

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