{
"item_title" : "Introduction to Microelectronics Advanced Packaging Assurance",
"item_author" : [" Navid Asadizanjani", "Himanandhan Reddy Kottur", "Hamed Dalir "],
"item_description" : "This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.",
"item_img_path" : "https://covers2.booksamillion.com/covers/bam/3/03/186/101/3031861019_b.jpg",
"price_data" : {
"retail_price" : "54.99", "online_price" : "54.99", "our_price" : "54.99", "club_price" : "54.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : ""
}
}
Introduction to Microelectronics Advanced Packaging Assurance
Overview
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
This item is Non-Returnable
Customers Also Bought
Details
- ISBN-13: 9783031861017
- ISBN-10: 3031861019
- Publisher: Springer
- Publish Date: April 2025
- Dimensions: 9.61 x 6.69 x 0.5 inches
- Shipping Weight: 1.17 pounds
- Page Count: 183
Related Categories
