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"item_title" : "Materials for Information Technology",
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Materials for Information Technology : Devices, Interconnects and Packaging
Overview
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
This item is Non-Returnable
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Details
- ISBN-13: 9781852339418
- ISBN-10: 1852339411
- Publisher: Springer
- Publish Date: September 2005
- Dimensions: 9.21 x 6.14 x 1.13 inches
- Shipping Weight: 2.02 pounds
- Page Count: 508
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