{ "item_title" : "Modeling and Application of Flexible Electronics Packaging", "item_author" : [" Yongan Huang", "Zhouping Yin", "Xiaodong Wan "], "item_description" : "Advanced Electronics Packaging.- Interfacial Modeling of Flexible Multilayer Structures.- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy.- Shear-Assisted Peeling.- Single-Needle Peeling.- Multi-Needle Peeling.- Conformal Peeling.- Laser Lift-Off.- Vacuum-Based Picking-up and Placing-on.", "item_img_path" : "https://covers4.booksamillion.com/covers/bam/9/81/133/626/9811336261_b.jpg", "price_data" : { "retail_price" : "109.99", "online_price" : "109.99", "our_price" : "109.99", "club_price" : "109.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

Overview

Customers Also Bought

Details