{ "item_title" : "Moisture Sensitivity of Plastic Packages of IC Devices", "item_author" : [" Xuejun Fan", "E. Suhir "], "item_description" : "Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging.- Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds.- Real-Time Characterization of Moisture Absorption and Desorption.- Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices.- Characterization of Hygroscopic Deformations by MoirInterferometry.- Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques.- Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis.- Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages.- Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages.- Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections.- Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices.- Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices.- New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels.- Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages.- Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages.- Industrial Applications of Moisture-Related Reliability Problems.- Underfill Selection Against Moisture in Flip Chip BGA Packages.- Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs).- Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging.- Moisture-Driven Electromigrative Degradation in Microelectronic Packages.- Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation.", "item_img_path" : "https://covers2.booksamillion.com/covers/bam/1/46/142/625/1461426251_b.jpg", "price_data" : { "retail_price" : "279.99", "online_price" : "279.99", "our_price" : "279.99", "club_price" : "279.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

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