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"item_title" : "Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module",
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module : Ceramic Research and Development in Japan
by K. Otsuka
Overview
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
This item is Non-Returnable
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Details
- ISBN-13: 9781851665792
- ISBN-10: 185166579X
- Publisher: Springer
- Publish Date: April 1993
- Dimensions: 9.21 x 6.14 x 0.63 inches
- Shipping Weight: 1.19 pounds
- Page Count: 242
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