{
"item_title" : "Packaging and Embedded Electronics for the Next Generation",
"item_author" : [" Nasa Technical Reports Server (Ntrs)", "Michael J. Sampson "],
"item_description" : "This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.",
"item_img_path" : "https://covers1.booksamillion.com/covers/bam/1/28/925/056/1289250561_b.jpg",
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Packaging and Embedded Electronics for the Next Generation
Overview
This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.
This item is Non-Returnable
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Details
- ISBN-13: 9781289250560
- ISBN-10: 1289250561
- Publisher: Bibliogov
- Publish Date: July 2013
- Dimensions: 9.69 x 7.44 x 0.05 inches
- Shipping Weight: 0.14 pounds
- Page Count: 24
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