{ "item_title" : "RF and Microwave Microelectronics Packaging II", "item_author" : [" Ken Kuang", "Rick Sturdivant "], "item_description" : "This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave Microelectronics Packaging (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.", "item_img_path" : "https://covers4.booksamillion.com/covers/bam/3/31/951/696/3319516965_b.jpg", "price_data" : { "retail_price" : "139.99", "online_price" : "139.99", "our_price" : "139.99", "club_price" : "139.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

Overview

Customers Also Bought

Details