{ "item_title" : "Self-Organized 3D Integrated Optical Interconnects", "item_author" : [" Tetsuzo Yoshimura "], "item_description" : "Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve short line distances of the cm-mm order and large line counts of hundreds-thousands. This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.", "item_img_path" : "https://covers3.booksamillion.com/covers/bam/9/81/487/704/9814877042_b.jpg", "price_data" : { "retail_price" : "149.95", "online_price" : "149.95", "our_price" : "149.95", "club_price" : "149.95", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

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