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Semiconductor Engineering Handbook : Devices, Fabrication, EUV Lithography, Advanced Packaging, Chiplets, and AI Chip Design from Wafer to Yield
Overview
This item is Non-Returnable
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Details
- ISBN-13: 9798174294134
- ISBN-10: 9798174294134
- Publisher: Independently Published
- Publish Date: September 2026
- Dimensions: 11 x 8.5 x 0.55 inches
- Shipping Weight: 1.36 pounds
- Page Count: 264
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