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{ "item_title" : "System-On-Chip for Real-Time Applications", "item_author" : [" Wael Badawy", "Graham A. Julien "], "item_description" : "System-on-Chip for Real-Time Applications will be of interest to engineers, both in industry and academia, working in the area of SoC VLSI design and application. It will also be useful to graduate and undergraduate students in electrical and computer engineering and computer science. A selected set of papers from the 2nd International Workshop on Real-Time Applications were used to form the basis of this book. It is organized into the following chapters: -Introduction; -Design Reuse; -Modeling; -Architecture; -Design Techniques; -Memory; -Circuits; -Low Power; -Interconnect and Technology; -MEMS.System-on-Chip for Real-Time Applications contains many signal processing applications and will be of particular interest to those working in that community.", "item_img_path" : "https://covers4.booksamillion.com/covers/bam/1/46/135/034/1461350344_b.jpg", "price_data" : { "retail_price" : "169.99", "online_price" : "169.99", "our_price" : "169.99", "club_price" : "169.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }
System-On-Chip for Real-Time Applications|Wael Badawy

System-On-Chip for Real-Time Applications

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Overview

System-on-Chip for Real-Time Applications will be of interest to engineers, both in industry and academia, working in the area of SoC VLSI design and application. It will also be useful to graduate and undergraduate students in electrical and computer engineering and computer science.
A selected set of papers from the 2nd International Workshop on Real-Time Applications were used to form the basis of this book. It is organized into the following chapters:

-Introduction;
-Design Reuse;
-Modeling;
-Architecture;
-Design Techniques;
-Memory;
-Circuits;
-Low Power;
-Interconnect and Technology;
-MEMS.

System-on-Chip for Real-Time Applications contains many signal processing applications and will be of particular interest to those working in that community.

This item is Non-Returnable

Details

  • ISBN-13: 9781461350347
  • ISBN-10: 1461350344
  • Publisher: Springer
  • Publish Date: November 2012
  • Dimensions: 9.21 x 6.14 x 0.96 inches
  • Shipping Weight: 1.46 pounds
  • Page Count: 456

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