{
"item_title" : "System Innovation for a Troubled World",
"item_author" : [" Artde Donald Kin-Tak Lam", "Stephen D. Prior", "Siu-Tsen Shen "],
"item_description" : "System Innovation for a Troubled World: Applied System Innovation VIII contains roughly one tenth of the total of 250 contributions from 8 different countries that were presented at the IEEE 8th International Conference on Applied System Innovation (ICASI 2022, Sun Moon Lake, Nantou, Taiwan, 21-23 April 2022). This book aims to provide an integrated communication platform for researchers from a wide range of topics including: Information Technology Communication Science Applied Mathematics Computer Science Advanced Material Science Engineering System Innovation for a Troubled World: Applied System Innovation VIII aims at science and engineering technologists, academics and professionals from the above mentioned areas.",
"item_img_path" : "https://covers4.booksamillion.com/covers/bam/1/03/245/525/103245525X_b.jpg",
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"retail_price" : "180.00", "online_price" : "180.00", "our_price" : "180.00", "club_price" : "180.00", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : ""
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System Innovation for a Troubled World : Applied System Innovation VIII. Proceedings of the IEEE 8th International Conference on Applied System Innovat
Overview
System Innovation for a Troubled World: Applied System Innovation VIII contains roughly one tenth of the total of 250 contributions from 8 different countries that were presented at the IEEE 8th International Conference on Applied System Innovation (ICASI 2022, Sun Moon Lake, Nantou, Taiwan, 21-23 April 2022). This book aims to provide an integrated communication platform for researchers from a wide range of topics including:
- Information Technology
- Communication Science
- Applied Mathematics
- Computer Science
- Advanced Material Science
- Engineering
System Innovation for a Troubled World: Applied System Innovation VIII aims at science and engineering technologists, academics and professionals from the above mentioned areas.
This item is Non-Returnable
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Details
- ISBN-13: 9781032455259
- ISBN-10: 103245525X
- Publisher: CRC Press
- Publish Date: May 2023
- Dimensions: 9.61 x 6.69 x 0.44 inches
- Shipping Weight: 1.08 pounds
- Page Count: 168
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