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{ "item_title" : "System Innovation for a World in Transition", "item_author" : [" Artde Donald Kin-Tak Lam", "Stephen D. Prior", "Siu-Tsen Shen "], "item_description" : "System Innovation for a World in Transition: Applied System Innovation IX includes the contributions presented at the IEEE 9th International Conference on Applied System Innovation (ICASI 2023, Chiba, Japan, 21-25 April 2023). The conference received more than 600 submitted papers from 12 different countries, whereby roughly one quarter of these papers was selected to present at ICASI 2023. The book aims to provide an integrated communication platform for researchers from a wide range of topics including information technology, communication science, applied mathematics, computer science, advanced material science, and engineering. Hopefully, it will enhance interdisciplinary collaborations between science and engineering technologists in the fields of academics and related industries", "item_img_path" : "https://covers1.booksamillion.com/covers/bam/1/03/260/846/1032608463_b.jpg", "price_data" : { "retail_price" : "225.00", "online_price" : "225.00", "our_price" : "225.00", "club_price" : "225.00", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }
System Innovation for a World in Transition|Artde Donald Kin-Tak Lam

System Innovation for a World in Transition : Applied System Innovation IX. Proceedings of the 9th International Conference on Applied System Innovatio

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Overview

System Innovation for a World in Transition: Applied System Innovation IX includes the contributions presented at the IEEE 9th International Conference on Applied System Innovation (ICASI 2023, Chiba, Japan, 21-25 April 2023). The conference received more than 600 submitted papers from 12 different countries, whereby roughly one quarter of these papers was selected to present at ICASI 2023. The book aims to provide an integrated communication platform for researchers from a wide range of topics including information technology, communication science, applied mathematics, computer science, advanced material science, and engineering. Hopefully, it will enhance interdisciplinary collaborations between science and engineering technologists in the fields of academics and related industries

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Details

  • ISBN-13: 9781032608464
  • ISBN-10: 1032608463
  • Publisher: CRC Press
  • Publish Date: December 2023
  • Dimensions: 9.61 x 6.69 x 0.88 inches
  • Shipping Weight: 1.81 pounds
  • Page Count: 378

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