{ "item_title" : "Testing of Interposer-Based 2.5d Integrated Circuits", "item_author" : [" Ran Wang", "Krishnendu Chakrabarty "], "item_description" : "This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.", "item_img_path" : "https://covers3.booksamillion.com/covers/bam/3/31/985/461/3319854615_b.jpg", "price_data" : { "retail_price" : "119.99", "online_price" : "119.99", "our_price" : "119.99", "club_price" : "119.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

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