{
"item_title" : "Area Array Packaging Processes",
"item_author" : [" Ken Gilleo "],
"item_description" : "This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.",
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Overview
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
This item is Non-Returnable
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Details
- ISBN-13: 9780071738019
- ISBN-10: 0071738010
- Publisher: McGraw-Hill
- Publish Date: October 2003
- Dimensions: 9.25 x 7.5 x 0.57 inches
- Shipping Weight: 1.04 pounds
- Page Count: 272
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