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Area Array Packaging Processes|Ken Gilleo

Area Array Packaging Processes

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Overview

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

This item is Non-Returnable

Details

  • ISBN-13: 9780071738019
  • ISBN-10: 0071738010
  • Publisher: McGraw-Hill
  • Publish Date: October 2003
  • Dimensions: 9.25 x 7.5 x 0.57 inches
  • Shipping Weight: 1.04 pounds
  • Page Count: 272

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