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{ "item_title" : "Foundations of Heterogeneous Integration", "item_author" : [" Farhang Yazdani "], "item_description" : "This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.", "item_img_path" : "https://covers3.booksamillion.com/covers/bam/3/31/975/767/3319757679_b.jpg", "price_data" : { "retail_price" : "139.99", "online_price" : "139.99", "our_price" : "139.99", "club_price" : "139.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }
Foundations of Heterogeneous Integration|Farhang Yazdani

Foundations of Heterogeneous Integration : An Industry-Based, 2.5d/3D Pathfinding and Co-Design Approach

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Overview

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.

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Details

  • ISBN-13: 9783319757674
  • ISBN-10: 3319757679
  • Publisher: Springer
  • Publish Date: March 2018
  • Dimensions: 9.21 x 6.14 x 0.5 inches
  • Shipping Weight: 0.97 pounds
  • Page Count: 177

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