{ "item_title" : "Heterogeneous Integrations", "item_author" : [" John H. Lau "], "item_description" : "Chapter 1. Overview of 3D IC Heterogeneous Integrations.- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates.- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers).- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges).- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates.- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking.- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats.- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats.- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL.- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.", "item_img_path" : "https://covers3.booksamillion.com/covers/bam/9/81/137/223/9811372233_b.jpg", "price_data" : { "retail_price" : "179.99", "online_price" : "179.99", "our_price" : "179.99", "club_price" : "179.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

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