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{ "item_title" : "Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines", "item_author" : [" Michael G. Pecht "], "item_description" : "Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins. Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals - incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions - round out this guide's comprehensive coverage.", "item_img_path" : "https://covers1.booksamillion.com/covers/bam/0/47/159/446/0471594466_b.jpg", "price_data" : { "retail_price" : "212.95", "online_price" : "212.95", "our_price" : "212.95", "club_price" : "212.95", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines|Michael G. Pecht

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines : A Focus on Reliability

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Overview

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins. Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals - incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions - round out this guide's comprehensive coverage.

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Details

  • ISBN-13: 9780471594468
  • ISBN-10: 0471594466
  • Publisher: Wiley-Interscience
  • Publish Date: March 1994
  • Dimensions: 9.56 x 6.45 x 1.07 inches
  • Shipping Weight: 1.85 pounds
  • Page Count: 464

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