Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines : A Focus on Reliability
Overview
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins. Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals - incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions - round out this guide's comprehensive coverage.
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Details
- ISBN-13: 9780471594468
- ISBN-10: 0471594466
- Publisher: Wiley-Interscience
- Publish Date: March 1994
- Dimensions: 9.56 x 6.45 x 1.07 inches
- Shipping Weight: 1.85 pounds
- Page Count: 464
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