{ "item_title" : "Reliability Technology for Integrated Circuit Packaging", "item_author" : [" Bin Zhou", "Yunfei En", "Si Chen "], "item_description" : "This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress. Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of high-quality development a focus on reliability is essential to advancing manufacturing. Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry. ", "item_img_path" : "https://covers4.booksamillion.com/covers/bam/9/81/953/884/981953884X_b.jpg", "price_data" : { "retail_price" : "179.99", "online_price" : "179.99", "our_price" : "179.99", "club_price" : "179.99", "savings_pct" : "0", "savings_amt" : "0.00", "club_savings_pct" : "0", "club_savings_amt" : "0.00", "discount_pct" : "10", "store_price" : "" } }

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